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Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.[1] Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.
Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.
There is no single industry-standard method of wafer-level packaging at present.
A major application area of WLPs are smartphones due to the size constraints.
Scope of the Report:
This report focuses on the Wafer Level Packaging in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
The worldwide market for Wafer Level Packaging is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
Amkor Technology Inc
Fujitsu Ltd
Jiangsu Changjiang Electronics
Deca Technologies
Qualcomm Inc
Toshiba Corp
Tokyo Electron Ltd
Applied Materials, Inc
ASML Holding NV
Lam Research Corp
KLA-Tencor Corration
China Wafer Level CSP Co. Ltd
Marvell Technology Group Ltd
Siliconware Precision Industries
Nanium SA
STATS Chip
PAC Ltd
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
3D TSV WLP
2.5D TSV WLP
WLCSP
Nano WLP
Others ( 2D TSV WLP and Compliant WLP)
Market Segment by Applications, can be divided into
Electronics
IT & Telecommunication
Industrial
Automotive
Aerospace & Defense
Healthcare
Others (Media & Entertainment and Non-Conventional Energy Resources)
There are 15 Chapters to deeply display the global Wafer Level Packaging market.
Chapter 1, to describe Wafer Level Packaging Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Wafer Level Packaging, with sales, revenue, and price of Wafer Level Packaging, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Wafer Level Packaging, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Wafer Level Packaging market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Wafer Level Packaging sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source
The base year for the study has been considered 2019, historic year 2014 and 2018, the forecast period considered is from 2020 to 2027. The regions analyzed for the market include North America, Europe, South America, Asia Pacific, and Middle East and Africa. These regions are further analyzed at the country-level. The study also includes attractiveness analysis of type, application and regions which are benchmarked based on their market size, growth rate and attractiveness in terms of present and future opportunity for understanding the future growth of the market.
Market is segmented on the basis:
The report offers in-depth analysis of driving factors, opportunities, restraints, and challenges for gaining the key insight of the market. The report emphasizes on all the key trends that play a vital role in the enlargement of the market from 2019 to 2026.
The report provides company profile of the key players operating in the market and a comparative analysis based on their business overviews industry offering, segment market share, regional presence, business strategies, innovations, mergers & acquisitions, recent developments, joint venture, collaborations, partnerships, SWOT analysis, and key financial information.
Table of Contents
1 Market Overview
1.1 Wafer Level Packaging Introduction
1.2 Market Analysis by Type
1.2.1 3D TSV WLP
1.2.2 2.5D TSV WLP
1.2.3 WLCSP
1.2.4 Nano WLP
1.2.5 Others ( 2D TSV WLP and Compliant WLP)
1.3 Market Analysis by Applications
1.3.1 Electronics
1.3.2 IT & Telecommunication
1.3.3 Industrial
1.3.4 Automotive
1.3.5 Aerospace & Defense
1.3.6 Healthcare
1.3.7 Others (Media & Entertainment and Non-Conventional Energy Resources)
1.4 Market Analysis by Regions
1.4.1 North America (United States, Canada and Mexico)
1.4.1.1 United States Market States and Outlook (2013-2023)
1.4.1.2 Canada Market States and Outlook (2013-2023)
1.4.1.3 Mexico Market States and Outlook (2013-2023)
1.4.2 Europe (Germany, France, UK, Russia and Italy)
1.4.2.1 Germany Market States and Outlook (2013-2023)
1.4.2.2 France Market States and Outlook (2013-2023)
1.4.2.3 UK Market States and Outlook (2013-2023)
1.4.2.4 Russia Market States and Outlook (2013-2023)
1.4.2.5 Italy Market States and Outlook (2013-2023)
1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
1.4.3.1 China Market States and Outlook (2013-2023)
1.4.3.2 Japan Market States and Outlook (2013-2023)
1.4.3.3 Korea Market States and Outlook (2013-2023)
1.4.3.4 India Market States and Outlook (2013-2023)
1.4.3.5 Southeast Asia Market States and Outlook (2013-2023)
1.4.4 South America, Middle East and Africa
1.4.4.1 Brazil Market States and Outlook (2013-2023)
1.4.4.2 Egypt Market States and Outlook (2013-2023)
1.4.4.3 Saudi Arabia Market States and Outlook (2013-2023)
1.4.4.4 South Africa Market States and Outlook (2013-2023)
1.4.4.5 Nigeria Market States and Outlook (2013-2023)
1.5 Market Dynamics
1.5.1 Market Opportunities
1.5.2 Market Risk
1.5.3 Market Driving Force
2 Manufacturers Profiles
2.1 Amkor Technology Inc
2.1.1 Business Overview
2.1.2 Wafer Level Packaging Type and Applications
2.1.2.1 Product A
2.1.2.2 Product B
2.1.3 Amkor Technology Inc Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.2 Fujitsu Ltd
2.2.1 Business Overview
2.2.2 Wafer Level Packaging Type and Applications
2.2.2.1 Product A
2.2.2.2 Product B
2.2.3 Fujitsu Ltd Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.3 Jiangsu Changjiang Electronics
2.3.1 Business Overview
2.3.2 Wafer Level Packaging Type and Applications
2.3.2.1 Product A
2.3.2.2 Product B
2.3.3 Jiangsu Changjiang Electronics Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.4 Deca Technologies
2.4.1 Business Overview
2.4.2 Wafer Level Packaging Type and Applications
2.4.2.1 Product A
2.4.2.2 Product B
2.4.3 Deca Technologies Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.5 Qualcomm Inc
2.5.1 Business Overview
2.5.2 Wafer Level Packaging Type and Applications
2.5.2.1 Product A
2.5.2.2 Product B
2.5.3 Qualcomm Inc Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.6 Toshiba Corp
2.6.1 Business Overview
2.6.2 Wafer Level Packaging Type and Applications
2.6.2.1 Product A
2.6.2.2 Product B
2.6.3 Toshiba Corp Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.7 Tokyo Electron Ltd
2.7.1 Business Overview
2.7.2 Wafer Level Packaging Type and Applications
2.7.2.1 Product A
2.7.2.2 Product B
2.7.3 Tokyo Electron Ltd Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.8 Applied Materials, Inc
2.8.1 Business Overview
2.8.2 Wafer Level Packaging Type and Applications
2.8.2.1 Product A
2.8.2.2 Product B
2.8.3 Applied Materials, Inc Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.9 ASML Holding NV
2.9.1 Business Overview
2.9.2 Wafer Level Packaging Type and Applications
2.9.2.1 Product A
2.9.2.2 Product B
2.9.3 ASML Holding NV Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.10 Lam Research Corp
2.10.1 Business Overview
2.10.2 Wafer Level Packaging Type and Applications
2.10.2.1 Product A
2.10.2.2 Product B
2.10.3 Lam Research Corp Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.11 KLA-Tencor Corration
2.11.1 Business Overview
2.11.2 Wafer Level Packaging Type and Applications
2.11.2.1 Product A
2.11.2.2 Product B
2.11.3 KLA-Tencor Corration Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.12 China Wafer Level CSP Co. Ltd
2.12.1 Business Overview
2.12.2 Wafer Level Packaging Type and Applications
2.12.2.1 Product A
2.12.2.2 Product B
2.12.3 China Wafer Level CSP Co. Ltd Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.13 Marvell Technology Group Ltd
2.13.1 Business Overview
2.13.2 Wafer Level Packaging Type and Applications
2.13.2.1 Product A
2.13.2.2 Product B
2.13.3 Marvell Technology Group Ltd Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.14 Siliconware Precision Industries
2.14.1 Business Overview
2.14.2 Wafer Level Packaging Type and Applications
2.14.2.1 Product A
2.14.2.2 Product B
2.14.3 Siliconware Precision Industries Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.15 Nanium SA
2.15.1 Business Overview
2.15.2 Wafer Level Packaging Type and Applications
2.15.2.1 Product A
2.15.2.2 Product B
2.15.3 Nanium SA Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.16 STATS Chip
2.16.1 Business Overview
2.16.2 Wafer Level Packaging Type and Applications
2.16.2.1 Product A
2.16.2.2 Product B
2.16.3 STATS Chip Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.17 PAC Ltd
2.17.1 Business Overview
2.17.2 Wafer Level Packaging Type and Applications
2.17.2.1 Product A
2.17.2.2 Product B
2.17.3 PAC Ltd Wafer Level Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
3 Global Wafer Level Packaging Sales, Revenue, Market Share and Competition by Manufacturer (2016-2017)
3.1 Global Wafer Level Packaging Sales and Market Share by Manufacturer (2016-2017)
3.2 Global Wafer Level Packaging Revenue and Market Share by Manufacturer (2016-2017)
3.3 Market Concentration Rate
3.3.1 Top 3 Wafer Level Packaging Manufacturer Market Share in 2017
3.3.2 Top 6 Wafer Level Packaging Manufacturer Market Share in 2017
3.4 Market Competition Trend
4 Global Wafer Level Packaging Market Analysis by Regions
4.1 Global Wafer Level Packaging Sales, Revenue and Market Share by Regions
4.1.1 Global Wafer Level Packaging Sales and Market Share by Regions (2013-2018)
4.1.2 Global Wafer Level Packaging Revenue and Market Share by Regions (2013-2018)
4.2 North America Wafer Level Packaging Sales and Growth Rate (2013-2018)
4.3 Europe Wafer Level Packaging Sales and Growth Rate (2013-2018)
4.4 Asia-Pacific Wafer Level Packaging Sales and Growth Rate (2013-2018)
4.5 South America Wafer Level Packaging Sales and Growth Rate (2013-2018)
4.6 Middle East and Africa Wafer Level Packaging Sales and Growth Rate (2013-2018)
5 North America Wafer Level Packaging by Countries
5.1 North America Wafer Level Packaging Sales, Revenue and Market Share by Countries
5.1.1 North America Wafer Level Packaging Sales and Market Share by Countries (2013-2018)
5.1.2 North America Wafer Level Packaging Revenue and Market Share by Countries (2013-2018)
5.2 United States Wafer Level Packaging Sales and Growth Rate (2013-2018)
5.3 Canada Wafer Level Packaging Sales and Growth Rate (2013-2018)
5.4 Mexico Wafer Level Packaging Sales and Growth Rate (2013-2018)
6 Europe Wafer Level Packaging by Countries
6.1 Europe Wafer Level Packaging Sales, Revenue and Market Share by Countries
6.1.1 Europe Wafer Level Packaging Sales and Market Share by Countries (2013-2018)
6.1.2 Europe Wafer Level Packaging Revenue and Market Share by Countries (2013-2018)
6.2 Germany Wafer Level Packaging Sales and Growth Rate (2013-2018)
6.3 UK Wafer Level Packaging Sales and Growth Rate (2013-2018)
6.4 France Wafer Level Packaging Sales and Growth Rate (2013-2018)
6.5 Russia Wafer Level Packaging Sales and Growth Rate (2013-2018)
6.6 Italy Wafer Level Packaging Sales and Growth Rate (2013-2018)
7 Asia-Pacific Wafer Level Packaging by Countries
7.1 Asia-Pacific Wafer Level Packaging Sales, Revenue and Market Share by Countries
7.1.1 Asia-Pacific Wafer Level Packaging Sales and Market Share by Countries (2013-2018)
7.1.2 Asia-Pacific Wafer Level Packaging Revenue and Market Share by Countries (2013-2018)
7.2 China Wafer Level Packaging Sales and Growth Rate (2013-2018)
7.3 Japan Wafer Level Packaging Sales and Growth Rate (2013-2018)
7.4 Korea Wafer Level Packaging Sales and Growth Rate (2013-2018)
7.5 India Wafer Level Packaging Sales and Growth Rate (2013-2018)
7.6 Southeast Asia Wafer Level Packaging Sales and Growth Rate (2013-2018)
8 South America Wafer Level Packaging by Countries
8.1 South America Wafer Level Packaging Sales, Revenue and Market Share by Countries
8.1.1 South America Wafer Level Packaging Sales and Market Share by Countries (2013-2018)
8.1.2 South America Wafer Level Packaging Revenue and Market Share by Countries (2013-2018)
8.2 Brazil Wafer Level Packaging Sales and Growth Rate (2013-2018)
8.3 Argentina Wafer Level Packaging Sales and Growth Rate (2013-2018)
8.4 Colombia Wafer Level Packaging Sales and Growth Rate (2013-2018)
9 Middle East and Africa Wafer Level Packaging by Countries
9.1 Middle East and Africa Wafer Level Packaging Sales, Revenue and Market Share by Countries
9.1.1 Middle East and Africa Wafer Level Packaging Sales and Market Share by Countries (2013-2018)
9.1.2 Middle East and Africa Wafer Level Packaging Revenue and Market Share by Countries (2013-2018)
9.2 Saudi Arabia Wafer Level Packaging Sales and Growth Rate (2013-2018)
9.3 UAE Wafer Level Packaging Sales and Growth Rate (2013-2018)
9.4 Egypt Wafer Level Packaging Sales and Growth Rate (2013-2018)
9.5 Nigeria Wafer Level Packaging Sales and Growth Rate (2013-2018)
9.6 South Africa Wafer Level Packaging Sales and Growth Rate (2013-2018)
10 Global Wafer Level Packaging Market Segment by Type
10.1 Global Wafer Level Packaging Sales, Revenue and Market Share by Type (2013-2018)
10.1.1 Global Wafer Level Packaging Sales and Market Share by Type (2013-2018)
10.1.2 Global Wafer Level Packaging Revenue and Market Share by Type (2013-2018)
10.2 3D TSV WLP Sales Growth and Price
10.2.1 Global 3D TSV WLP Sales Growth (2013-2018)
10.2.2 Global 3D TSV WLP Price (2013-2018)
10.3 2.5D TSV WLP Sales Growth and Price
10.3.1 Global 2.5D TSV WLP Sales Growth (2013-2018)
10.3.2 Global 2.5D TSV WLP Price (2013-2018)
10.4 WLCSP Sales Growth and Price
10.4.1 Global WLCSP Sales Growth (2013-2018)
10.4.2 Global WLCSP Price (2013-2018)
10.5 Nano WLP Sales Growth and Price
10.5.1 Global Nano WLP Sales Growth (2013-2018)
10.5.2 Global Nano WLP Price (2013-2018)
10.6 Others ( 2D TSV WLP and Compliant WLP) Sales Growth and Price
10.6.1 Global Others ( 2D TSV WLP and Compliant WLP) Sales Growth (2013-2018)
10.6.2 Global Others ( 2D TSV WLP and Compliant WLP) Price (2013-2018)
11 Global Wafer Level Packaging Market Segment by Application
11.1 Global Wafer Level Packaging Sales Market Share by Application (2013-2018)
11.2 Electronics Sales Growth (2013-2018)
11.3 IT & Telecommunication Sales Growth (2013-2018)
11.4 Industrial Sales Growth (2013-2018)
11.5 Automotive Sales Growth (2013-2018)
11.6 Aerospace & Defense Sales Growth (2013-2018)
11.7 Healthcare Sales Growth (2013-2018)
11.8 Others (Media & Entertainment and Non-Conventional Energy Resources) Sales Growth (2013-2018)
12 Wafer Level Packaging Market Forecast (2018-2023)
12.1 Global Wafer Level Packaging Sales, Revenue and Growth Rate (2018-2023)
12.2 Wafer Level Packaging Market Forecast by Regions (2018-2023)
12.2.1 North America Wafer Level Packaging Market Forecast (2018-2023)
12.2.2 Europe Wafer Level Packaging Market Forecast (2018-2023)
12.2.3 Asia-Pacific Wafer Level Packaging Market Forecast (2018-2023)
12.2.4 South America Wafer Level Packaging Market Forecast (2018-2023)
12.2.5 Middle East and Africa Wafer Level Packaging Market Forecast (2018-2023)
12.3 Wafer Level Packaging Market Forecast by Type (2018-2023)
12.3.1 Global Wafer Level Packaging Sales Forecast by Type (2018-2023)
12.3.2 Global Wafer Level Packaging Market Share Forecast by Type (2018-2023)
12.4 Wafer Level Packaging Market Forecast by Application (2018-2023)
12.4.1 Global Wafer Level Packaging Sales Forecast by Application (2018-2023)
12.4.2 Global Wafer Level Packaging Market Share Forecast by Application (2018-2023)
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.1.3 Marketing Channel Future Trend
13.2 Distributors, Traders and Dealers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Data Source
List of Tables and Figures
Figure Wafer Level Packaging Picture
Table Product Specifications of Wafer Level Packaging
Figure Global Sales Market Share of Wafer Level Packaging by Types in 2017
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