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FOWLP is a chip packaging technology that is used to package an IC, while the IC is still part of the wafer.
Scope of the Report:
This report studies the Fan-out Wafer Level Packaging market status and outlook of Global and major regions, from angles of players, countries, product types and end industries; this report analyzes the top players in global market, and splits the Fan-out Wafer Level Packaging market by product type and applications/end industries.
In terms of geography, APAC led the global FOWLP market. According to analysts, the region will continue to dominate this market during the forecast period as well and this will mainly attribute to the presence of major semiconductor industries in the region.
The global Fan-out Wafer Level Packaging market is valued at xx million USD in 2017 and is expected to reach xx million USD by the end of 2023, growing at a CAGR of xx% between 2017 and 2023.
The Asia-Pacific will occupy for more market share in following years, especially in China, also fast growing India and Southeast Asia regions.
North America, especially The United States, will still play an important role which cannot be ignored. Any changes from United States might affect the development trend of Fan-out Wafer Level Packaging.
Europe also play important roles in global market, with market size of xx million USD in 2017 and will be xx million USD in 2023, with a CAGR of xx%.
Market Segment by Companies, this report covers
STATS ChipPAC
TSMC
Texas Instruments
Rudolph Technologies
SEMES
SUSS MicroTec
STMicroelectronics
Ultratech
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
200mm Wafer Level Packaging
300mm Wafer Level Packaging
Other
Market Segment by Applications, can be divided into
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Other
The base year for the study has been considered 2019, historic year 2014 and 2018, the forecast period considered is from 2020 to 2027. The regions analyzed for the market include North America, Europe, South America, Asia Pacific, and Middle East and Africa. These regions are further analyzed at the country-level. The study also includes attractiveness analysis of type, application and regions which are benchmarked based on their market size, growth rate and attractiveness in terms of present and future opportunity for understanding the future growth of the market.
Market is segmented on the basis:
The report offers in-depth analysis of driving factors, opportunities, restraints, and challenges for gaining the key insight of the market. The report emphasizes on all the key trends that play a vital role in the enlargement of the market from 2019 to 2026.
The report provides company profile of the key players operating in the market and a comparative analysis based on their business overviews industry offering, segment market share, regional presence, business strategies, innovations, mergers & acquisitions, recent developments, joint venture, collaborations, partnerships, SWOT analysis, and key financial information.
Table of Contents
1 Fan-out Wafer Level Packaging Market Overview
1.1 Product Overview and Scope of Fan-out Wafer Level Packaging
1.2 Classification of Fan-out Wafer Level Packaging by Types
1.2.1 Global Fan-out Wafer Level Packaging Revenue Comparison by Types (2017-2023)
1.2.2 Global Fan-out Wafer Level Packaging Revenue Market Share by Types in 2017
1.2.3 200mm Wafer Level Packaging
1.2.4 300mm Wafer Level Packaging
1.2.5 Other
1.3 Global Fan-out Wafer Level Packaging Market by Application
1.3.1 Global Fan-out Wafer Level Packaging Market Size and Market Share Comparison by Applications (2013-2023)
1.3.2 CMOS Image Sensor
1.3.3 Wireless Connectivity
1.3.4 Logic and Memory IC
1.3.5 MEMS and Sensor
1.3.6 Analog and Mixed IC
1.3.7 Other
1.4 Global Fan-out Wafer Level Packaging Market by Regions
1.4.1 Global Fan-out Wafer Level Packaging Market Size (Million USD) Comparison by Regions (2013-2023)
1.4.1 North America (USA, Canada and Mexico) Fan-out Wafer Level Packaging Status and Prospect (2013-2023)
1.4.2 Europe (Germany, France, UK, Russia and Italy) Fan-out Wafer Level Packaging Status and Prospect (2013-2023)
1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia) Fan-out Wafer Level Packaging Status and Prospect (2013-2023)
1.4.4 South America (Brazil, Argentina, Colombia) Fan-out Wafer Level Packaging Status and Prospect (2013-2023)
1.4.5 Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa) Fan-out Wafer Level Packaging Status and Prospect (2013-2023)
1.5 Global Market Size of Fan-out Wafer Level Packaging (2013-2023)
2 Manufacturers Profiles
2.1 STATS ChipPAC
2.1.1 Business Overview
2.1.2 Fan-out Wafer Level Packaging Type and Applications
2.1.2.1 Product A
2.1.2.2 Product B
2.1.3 STATS ChipPAC Fan-out Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)
2.2 TSMC
2.2.1 Business Overview
2.2.2 Fan-out Wafer Level Packaging Type and Applications
2.2.2.1 Product A
2.2.2.2 Product B
2.2.3 TSMC Fan-out Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)
2.3 Texas Instruments
2.3.1 Business Overview
2.3.2 Fan-out Wafer Level Packaging Type and Applications
2.3.2.1 Product A
2.3.2.2 Product B
2.3.3 Texas Instruments Fan-out Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)
2.4 Rudolph Technologies
2.4.1 Business Overview
2.4.2 Fan-out Wafer Level Packaging Type and Applications
2.4.2.1 Product A
2.4.2.2 Product B
2.4.3 Rudolph Technologies Fan-out Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)
2.5 SEMES
2.5.1 Business Overview
2.5.2 Fan-out Wafer Level Packaging Type and Applications
2.5.2.1 Product A
2.5.2.2 Product B
2.5.3 SEMES Fan-out Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)
2.6 SUSS MicroTec
2.6.1 Business Overview
2.6.2 Fan-out Wafer Level Packaging Type and Applications
2.6.2.1 Product A
2.6.2.2 Product B
2.6.3 SUSS MicroTec Fan-out Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)
2.7 STMicroelectronics
2.7.1 Business Overview
2.7.2 Fan-out Wafer Level Packaging Type and Applications
2.7.2.1 Product A
2.7.2.2 Product B
2.7.3 STMicroelectronics Fan-out Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)
2.8 Ultratech
2.8.1 Business Overview
2.8.2 Fan-out Wafer Level Packaging Type and Applications
2.8.2.1 Product A
2.8.2.2 Product B
2.8.3 Ultratech Fan-out Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)
3 Global Fan-out Wafer Level Packaging Market Competition, by Players
3.1 Global Fan-out Wafer Level Packaging Revenue and Share by Players (2013-2018)
3.2 Market Concentration Rate
3.2.1 Top 5 Fan-out Wafer Level Packaging Players Market Share
3.2.2 Top 10 Fan-out Wafer Level Packaging Players Market Share
3.3 Market Competition Trend
4 Global Fan-out Wafer Level Packaging Market Size by Regions
4.1 Global Fan-out Wafer Level Packaging Revenue and Market Share by Regions
4.2 North America Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
4.3 Europe Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
4.4 Asia-Pacific Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
4.5 South America Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
4.6 Middle East and Africa Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
5 North America Fan-out Wafer Level Packaging Revenue by Countries
5.1 North America Fan-out Wafer Level Packaging Revenue by Countries (2013-2018)
5.2 USA Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
5.3 Canada Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
5.4 Mexico Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
6 Europe Fan-out Wafer Level Packaging Revenue by Countries
6.1 Europe Fan-out Wafer Level Packaging Revenue by Countries (2013-2018)
6.2 Germany Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
6.3 UK Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
6.4 France Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
6.5 Russia Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
6.6 Italy Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
7 Asia-Pacific Fan-out Wafer Level Packaging Revenue by Countries
7.1 Asia-Pacific Fan-out Wafer Level Packaging Revenue by Countries (2013-2018)
7.2 China Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
7.3 Japan Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
7.4 Korea Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
7.5 India Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
7.6 Southeast Asia Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
8 South America Fan-out Wafer Level Packaging Revenue by Countries
8.1 South America Fan-out Wafer Level Packaging Revenue by Countries (2013-2018)
8.2 Brazil Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
8.3 Argentina Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
8.4 Colombia Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
9 Middle East and Africa Revenue Fan-out Wafer Level Packaging by Countries
9.1 Middle East and Africa Fan-out Wafer Level Packaging Revenue by Countries (2013-2018)
9.2 Saudi Arabia Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
9.3 UAE Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
9.4 Egypt Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
9.5 Nigeria Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
9.6 South Africa Fan-out Wafer Level Packaging Revenue and Growth Rate (2013-2018)
10 Global Fan-out Wafer Level Packaging Market Segment by Type
10.1 Global Fan-out Wafer Level Packaging Revenue and Market Share by Type (2013-2018)
10.2 Global Fan-out Wafer Level Packaging Market Forecast by Type (2018-2023)
10.3 200mm Wafer Level Packaging Revenue Growth Rate (2013-2023)
10.4 300mm Wafer Level Packaging Revenue Growth Rate (2013-2023)
10.5 Other Revenue Growth Rate (2013-2023)
11 Global Fan-out Wafer Level Packaging Market Segment by Application
11.1 Global Fan-out Wafer Level Packaging Revenue Market Share by Application (2013-2018)
11.2 Fan-out Wafer Level Packaging Market Forecast by Application (2018-2023)
11.3 CMOS Image Sensor Revenue Growth (2013-2018)
11.4 Wireless Connectivity Revenue Growth (2013-2018)
11.5 Logic and Memory IC Revenue Growth (2013-2018)
11.6 MEMS and Sensor Revenue Growth (2013-2018)
11.7 Analog and Mixed IC Revenue Growth (2013-2018)
11.8 Other Revenue Growth (2013-2018)
12 Global Fan-out Wafer Level Packaging Market Size Forecast (2018-2023)
12.1 Global Fan-out Wafer Level Packaging Market Size Forecast (2018-2023)
12.2 Global Fan-out Wafer Level Packaging Market Forecast by Regions (2018-2023)
12.3 North America Fan-out Wafer Level Packaging Revenue Market Forecast (2018-2023)
12.4 Europe Fan-out Wafer Level Packaging Revenue Market Forecast (2018-2023)
12.5 Asia-Pacific Fan-out Wafer Level Packaging Revenue Market Forecast (2018-2023)
12.6 South America Fan-out Wafer Level Packaging Revenue Market Forecast (2018-2023)
12.7 Middle East and Africa Fan-out Wafer Level Packaging Revenue Market Forecast (2018-2023)
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Data Source
List of Tables and Figures
Figure Fan-out Wafer Level Packaging Picture
Table Product Specifications of Fan-out Wafer Level Packaging
Table Global Fan-out Wafer Level Packaging and Revenue (Million U
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