Global Fan-in Wafer Level Packaging Market 2018 by Manufacturers, Countries, Type and Application, Forecast to 2023

  • receipt Report ID : 145127
  • calendar_today Published On: Apr, 2019
  • file_copy Pages: 133
  • list Business Services

Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.

Scope of the Report:

This report studies the Fan-in Wafer Level Packaging market status and outlook of Global and major regions, from angles of players, countries, product types and end industries; this report analyzes the top players in global market, and splits the Fan-in Wafer Level Packaging market by product type and applications/end industries.

The analog and mixed IC segment accounted for the major shares and dominated the market. The demand for analog ICs from different segments such as consumer electronics, communications, and automotive and the increasing adoption of smartphones, phablets, and tablets, will fuel the growth of the market segment in the coming years. Additionally, technological advancements in the semiconductor industry that demand the need to ensure the robust performance of advanced ICs will also drive the demand for fan-in WLP packaging.

In terms of geographical regions, APAC will be the major revenue contributor to the market throughout the next few years. This is mainly due to the presence of a number of semiconductor foundries in this region. Moreover, the rise in demand for semiconductor devices due to the presence of prominent consumer electronics manufacturers, such as Samsung, Sony, LG, Toshiba, and Panasonic, will also bolster this market’s growth prospects.

The global Fan-in Wafer Level Packaging market is valued at xx million USD in 2017 and is expected to reach xx million USD by the end of 2023, growing at a CAGR of xx% between 2017 and 2023.

The Asia-Pacific will occupy for more market share in following years, especially in China, also fast growing India and Southeast Asia regions.

North America, especially The United States, will still play an important role which cannot be ignored. Any changes from United States might affect the development trend of Fan-in Wafer Level Packaging.

Europe also play important roles in global market, with market size of xx million USD in 2017 and will be xx million USD in 2023, with a CAGR of xx%.

Market Segment by Companies, this report covers

STATS ChipPAC

STMicroelectronics

TSMC

Texas Instruments

Rudolph Technologies

SEMES

SUSS MicroTec

Ultratech

FlipChip International

Market Segment by Regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia and Italy)

Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

South America (Brazil, Argentina, Colombia)

Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers

200mm Wafer Level Packaging

300mm Wafer Level Packaging

Other

Market Segment by Applications, can be divided into

CMOS Image Sensor

Wireless Connectivity

Logic and Memory IC

MEMS and Sensor

Analog and Mixed IC

Other

Frequently Asked Questions

The base year for the study has been considered 2019, historic year 2014 and 2018, the forecast period considered is from 2020 to 2027. The regions analyzed for the market include North America, Europe, South America, Asia Pacific, and Middle East and Africa. These regions are further analyzed at the country-level. The study also includes attractiveness analysis of type, application and regions which are benchmarked based on their market size, growth rate and attractiveness in terms of present and future opportunity for understanding the future growth of the market.

Market is segmented on the basis:

  • By Type
  • By Application
  • By Region
  • By Country
  • By Manufacturer

The report offers in-depth analysis of driving factors, opportunities, restraints, and challenges for gaining the key insight of the market. The report emphasizes on all the key trends that play a vital role in the enlargement of the market from 2019 to 2026.

The report provides company profile of the key players operating in the market and a comparative analysis based on their business overviews industry offering, segment market share, regional presence, business strategies, innovations, mergers & acquisitions, recent developments, joint venture, collaborations, partnerships, SWOT analysis, and key financial information.

Table of Contents

1 Fan-in Wafer Level Packaging Market Overview

1.1 Product Overview and Scope of Fan-in Wafer Level Packaging

1.2 Classification of Fan-in Wafer Level Packaging by Types

1.2.1 Global Fan-in Wafer Level Packaging Revenue Comparison by Types (2017-2023)

1.2.2 Global Fan-in Wafer Level Packaging Revenue Market Share by Types in 2017

1.2.3 200mm Wafer Level Packaging

1.2.4 300mm Wafer Level Packaging

1.2.5 Other

1.3 Global Fan-in Wafer Level Packaging Market by Application

1.3.1 Global Fan-in Wafer Level Packaging Market Size and Market Share Comparison by Applications (2013-2023)

1.3.2 CMOS Image Sensor

1.3.3 Wireless Connectivity

1.3.4 Logic and Memory IC

1.3.5 MEMS and Sensor

1.3.6 Analog and Mixed IC

1.3.7 Other

1.4 Global Fan-in Wafer Level Packaging Market by Regions

1.4.1 Global Fan-in Wafer Level Packaging Market Size (Million USD) Comparison by Regions (2013-2023)

1.4.1 North America (USA, Canada and Mexico) Fan-in Wafer Level Packaging Status and Prospect (2013-2023)

1.4.2 Europe (Germany, France, UK, Russia and Italy) Fan-in Wafer Level Packaging Status and Prospect (2013-2023)

1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia) Fan-in Wafer Level Packaging Status and Prospect (2013-2023)

1.4.4 South America (Brazil, Argentina, Colombia) Fan-in Wafer Level Packaging Status and Prospect (2013-2023)

1.4.5 Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa) Fan-in Wafer Level Packaging Status and Prospect (2013-2023)

1.5 Global Market Size of Fan-in Wafer Level Packaging (2013-2023)

2 Manufacturers Profiles

2.1 STATS ChipPAC

2.1.1 Business Overview

2.1.2 Fan-in Wafer Level Packaging Type and Applications

2.1.2.1 Product A

2.1.2.2 Product B

2.1.3 STATS ChipPAC Fan-in Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)

2.2 STMicroelectronics

2.2.1 Business Overview

2.2.2 Fan-in Wafer Level Packaging Type and Applications

2.2.2.1 Product A

2.2.2.2 Product B

2.2.3 STMicroelectronics Fan-in Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)

2.3 TSMC

2.3.1 Business Overview

2.3.2 Fan-in Wafer Level Packaging Type and Applications

2.3.2.1 Product A

2.3.2.2 Product B

2.3.3 TSMC Fan-in Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)

2.4 Texas Instruments

2.4.1 Business Overview

2.4.2 Fan-in Wafer Level Packaging Type and Applications

2.4.2.1 Product A

2.4.2.2 Product B

2.4.3 Texas Instruments Fan-in Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)

2.5 Rudolph Technologies

2.5.1 Business Overview

2.5.2 Fan-in Wafer Level Packaging Type and Applications

2.5.2.1 Product A

2.5.2.2 Product B

2.5.3 Rudolph Technologies Fan-in Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)

2.6 SEMES

2.6.1 Business Overview

2.6.2 Fan-in Wafer Level Packaging Type and Applications

2.6.2.1 Product A

2.6.2.2 Product B

2.6.3 SEMES Fan-in Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)

2.7 SUSS MicroTec

2.7.1 Business Overview

2.7.2 Fan-in Wafer Level Packaging Type and Applications

2.7.2.1 Product A

2.7.2.2 Product B

2.7.3 SUSS MicroTec Fan-in Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)

2.8 Ultratech

2.8.1 Business Overview

2.8.2 Fan-in Wafer Level Packaging Type and Applications

2.8.2.1 Product A

2.8.2.2 Product B

2.8.3 Ultratech Fan-in Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)

2.9 FlipChip International

2.9.1 Business Overview

2.9.2 Fan-in Wafer Level Packaging Type and Applications

2.9.2.1 Product A

2.9.2.2 Product B

2.9.3 FlipChip International Fan-in Wafer Level Packaging Revenue, Gross Margin and Market Share (2016-2017)

3 Global Fan-in Wafer Level Packaging Market Competition, by Players

3.1 Global Fan-in Wafer Level Packaging Revenue and Share by Players (2013-2018)

3.2 Market Concentration Rate

3.2.1 Top 5 Fan-in Wafer Level Packaging Players Market Share

3.2.2 Top 10 Fan-in Wafer Level Packaging Players Market Share

3.3 Market Competition Trend

4 Global Fan-in Wafer Level Packaging Market Size by Regions

4.1 Global Fan-in Wafer Level Packaging Revenue and Market Share by Regions

4.2 North America Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

4.3 Europe Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

4.4 Asia-Pacific Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

4.5 South America Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

4.6 Middle East and Africa Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

5 North America Fan-in Wafer Level Packaging Revenue by Countries

5.1 North America Fan-in Wafer Level Packaging Revenue by Countries (2013-2018)

5.2 USA Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

5.3 Canada Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

5.4 Mexico Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

6 Europe Fan-in Wafer Level Packaging Revenue by Countries

6.1 Europe Fan-in Wafer Level Packaging Revenue by Countries (2013-2018)

6.2 Germany Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

6.3 UK Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

6.4 France Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

6.5 Russia Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

6.6 Italy Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

7 Asia-Pacific Fan-in Wafer Level Packaging Revenue by Countries

7.1 Asia-Pacific Fan-in Wafer Level Packaging Revenue by Countries (2013-2018)

7.2 China Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

7.3 Japan Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

7.4 Korea Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

7.5 India Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

7.6 Southeast Asia Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

8 South America Fan-in Wafer Level Packaging Revenue by Countries

8.1 South America Fan-in Wafer Level Packaging Revenue by Countries (2013-2018)

8.2 Brazil Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

8.3 Argentina Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

8.4 Colombia Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

9 Middle East and Africa Revenue Fan-in Wafer Level Packaging by Countries

9.1 Middle East and Africa Fan-in Wafer Level Packaging Revenue by Countries (2013-2018)

9.2 Saudi Arabia Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

9.3 UAE Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

9.4 Egypt Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

9.5 Nigeria Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

9.6 South Africa Fan-in Wafer Level Packaging Revenue and Growth Rate (2013-2018)

10 Global Fan-in Wafer Level Packaging Market Segment by Type

10.1 Global Fan-in Wafer Level Packaging Revenue and Market Share by Type (2013-2018)

10.2 Global Fan-in Wafer Level Packaging Market Forecast by Type (2018-2023)

10.3 200mm Wafer Level Packaging Revenue Growth Rate (2013-2023)

10.4 300mm Wafer Level Packaging Revenue Growth Rate (2013-2023)

10.5 Other Revenue Growth Rate (2013-2023)

11 Global Fan-in Wafer Level Packaging Market Segment by Application

11.1 Global Fan-in Wafer Level Packaging Revenue Market Share by Application (2013-2018)

11.2 Fan-in Wafer Level Packaging Market Forecast by Application (2018-2023)

11.3 CMOS Image Sensor Revenue Growth (2013-2018)

11.4 Wireless Connectivity Revenue Growth (2013-2018)

11.5 Logic and Memory IC Revenue Growth (2013-2018)

11.6 MEMS and Sensor Revenue Growth (2013-2018)

11.7 Analog and Mixed IC Revenue Growth (2013-2018)

11.8 Other Revenue Growth (2013-2018)

12 Global Fan-in Wafer Level Packaging Market Size Forecast (2018-2023)

12.1 Global Fan-in Wafer Level Packaging Market Size Forecast (2018-2023)

12.2 Global Fan-in Wafer Level Packaging Market Forecast by Regions (2018-2023)

12.3 North America Fan-in Wafer Level Packaging Revenue Market Forecast (2018-2023)

12.4 Europe Fan-in Wafer Level Packaging Revenue Market Forecast (2018-2023)

12.5 Asia-Pacific Fan-in Wafer Level Packaging Revenue Market Forecast (2018-2023)

12.6 South America Fan-in Wafer Level Packaging Revenue Market Forecast (2018-2023)

12.7 Middle East and Africa Fan-in Wafer Level Packaging Revenue Market Forecast (2018-2023)

13 Research Findings and Conclusion

14 Appendix

14.1 Methodology

14.2 Data Source

List of Tables and Figures

Figure Fan-in Wafer Level Packaging Picture

Table Product Specifications of Fan-in Wafer Level Packaging

Table Global Fan-in Wafer Level Packaging and Revenue (Million USD)

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